#: locale=en
## Media
### Title
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album_C67087E7_E01A_B4C9_41E8_778D83856828_0.label = Agilex
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photo_8174FD94_EB2A_709B_D717_F3E8427242C4.label = Ambarella-CV72S
video_CE673FE9_DA5C_459B_41CF_F53167CF5FF1.label = Assembly_HomeScreen
photo_90E95691_8716_0972_DE59_736802676E3E.label = CTI-AGX-Orin-Forge
photo_12C0A52D_15FD_877D_B2B0_085FCBB44ACE.label = CTI-Jetson-OrinNX
photo_96897B23_8534_4809_41C9_19E03BFB9EA5.label = CV75SoM
album_C67087E7_E01A_B4C9_41E8_778D83856828_1.label = CannonLI8020SA
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photo_C5B7E0E4_E01E_ECCF_41D2_BAF6587AADD3.label = CannonLI8020SA
photo_07021FEC_D74C_19C8_1F2B_2453AB3FF79A.label = DX-H1 VPU
photo_C5B73315_E01E_ED49_41CC_0CB892119882.label = Deepx
photo_EF0175FA_CCA1_CC77_41E7_4DC0B3C59E9D.label = Deepx
album_C67087E7_E01A_B4C9_41E8_778D83856828_2.label = Deepx
video_C67CFF1D_DC35_FC3B_41E8_5F91DA43350A.label = Home_FROM_AGV
video_CE60E50F_DA5C_3A97_41E9_C10B40CD52E9.label = Home_FROM_Assembly
video_CE60C11E_DA5C_3AB9_41CE_D1D7688D65F4.label = Home_FROM_Packing
video_C6570108_DC35_A419_41A3_02EAC90D1F45.label = Home_FROM_Palletizer
video_C672982F_DC35_A416_41E6_D2DB0B315104.label = Home_FROM_Vision
video_C64E2F2E_DC37_9C16_41DF_1537B974B470.label = Home_TO_AGV
video_CE67CD93_DA5D_C58F_41E6_920CFE40C91D.label = Home_TO_Assembly
video_CC144976_DA5D_CA89_41E8_10544B0B005D.label = Home_TO_Packing
video_C6779F4A_DC34_BC1E_41E3_2F64A37EBEDF.label = Home_TO_Palletizer
video_C67D4264_DC34_A40A_41C8_651554C584AA.label = Home_TO_Vision
photo_51BFE064_5930_1F02_2774_05F13FF77AA8.label = Infineon-BGT60-Radar-Sensor
photo_BF722362_4B1B_9AEE_A6AC_28F1A26584C4.label = Infineon-PSoC MCU
photo_57631749_EEB5_BFD0_FE00_5276C276DCFC.label = Infineon-Real3
photo_90D205C2_84ED_D802_4162_C4D669E7D984.label = M30_thumb
photo_D62E117E_100E_8CAC_6B51_BC938283B64B.label = MacnicaDisplays
video_CE60D8E1_DA5C_4B8B_41C9_610CAD724A7B.label = Packing_HomeScreen
album_C67087E7_E01A_B4C9_41E8_778D83856828.label = Products
video_C67B9612_DC34_EC0E_41B2_7569DDF5C6EB.label = RoboticPalletizing_HomeScreen
photo_8A8FE293_84F4_3803_419B_3CD26350C212.label = RollingShutterSensor
photo_C5B700FA_E01E_ACBB_417E_7738BD203CBC.label = STREAL
album_C67087E7_E01A_B4C9_41E8_778D83856828_6.label = STREAL
photo_E850DCCB_CCA0_DC47_41D9_C75CFD6CF505.label = STREAL
photo_108D3404_1A67_22A1_EB4F_BEB77D23C4FA.label = Silex-WiFi-EP-200Q
video_C6D8E4B2_DC37_AC09_41D3_1DF2B5569665.label = SmartFactory_HomeScreen
photo_C5B7DD0C_E01E_9558_41D8_8102BF7AD507.label = SonyStarvis
album_C67087E7_E01A_B4C9_41E8_778D83856828_5.label = SonyStarvis
video_C64E755B_DC34_6C3F_41E5_6AC5514F093A.label = VisionInspection_HomeScreen
photo_970ECA83_852D_C80B_41E0_4F69B4BDFA69.label = agilex-i-series-chip-graphic
photo_B4995A4A_BEB6_ECF5_5739_6D484789D217.label = iEi-TANK-XM812
album_C67087E7_E01A_B4C9_41E8_778D83856828_3.label = namuga_tof_camera_module_transparent
photo_C5B72639_E01E_97B9_41E8_6560D7F55501.label = namuga_tof_camera_module_transparent
photo_30756871_5725_87A9_1550_2774BEBF2FB5.label = slvs-ec3-block-diagram
photo_E8077DC9_CCDF_FFD8_41D4_4C731B464B18.label = sony_pregius_cmos_sensor
photo_C5B7083A_E01E_9BBB_41C2_8AE78C1C2F07.label = sony_pregius_cmos_sensor
album_C67087E7_E01A_B4C9_41E8_778D83856828_4.label = sony_pregius_cmos_sensor
### Video
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### Video Subtitles
## Popup
### Body
htmlText_A39C5026_BC3E_357C_41DF_B27F3408F6D9.html = Role in This Application:
Low-light inspection in conveyor tunnels, enclosed scanner housings, and UV illumination chambers for tamper-evident seal verification. STARVIS 2 delivers best-in-class photon sensitivity where lighting cannot be increased without affecting the product or process.
Form Factor / Interface:
Packaged sensor (rolling shutter; Sony IMX675 / IMX778 class)
Key Differentiator:
Best-in-class low-light sensitivity
STARVIS 2 = improved SNR vs Gen 1
Role in This Application:
2D barcode scanning and label verification on each box before palletizing. Pregius S global shutter captures all pixels simultaneously, eliminating motion blur on moving boxes and ensuring reliable barcode decodes at conveyor speed.
Form Factor / Interface:
Packaged sensor (area scan; Sony IMX925 / IMX900 / IMX927 class)
Key Differentiator:
Global shutter high speed sensor reduces motion blur on moving targets and fast auto exposure enables; barcode reading at speed; Macnica is exclusive stocking partner for Sony sensors in the Americas; Pregius S BSI architecture delivers improved sensitivity and SNR vs. original Pregius
Role in This Application:
3D volume and dimension verification of packaged goods on the conveyor: confirms box dimensions match order specs before palletizing.
Form Factor / Interface:
Packaged sensor (area scan)
Key Differentiator:
Global shutter; high-resolution high speed lineup; no reduce motion blur; Macnica-exclusive stocking partner in Americas
Role in This Application:
3D volume and dimension verification of packaged goods on the inspection conveyor. The ToF module measures each box's height, width, and length in real time, confirming dimensions match order specifications before the item proceeds to palletizing. Also used for detecting tipped, misaligned, or damaged packages.
Form Factor / Interface:
Camera module (IP67)
Key Differentiator:
Point cloud + depth + IR outputs simultaneously; IP67 rated for washdown environments; 120fps high-speed mode; multi-camera support without signal interference; ROS2 and Jetson SDK included
Role in This Application:
3D volume and dimension verification of packaged goods on the inspection conveyor. The ToF module measures each box's height, width, and length in real time, confirming dimensions match order specifications before the item proceeds to palletizing. Also used for detecting tipped, misaligned, or damaged packages.
Form Factor / Interface:
Camera module (IP67)
Key Differentiator:
Point cloud + depth + IR outputs simultaneously; IP67 rated for washdown environments; 120fps high-speed mode; multi-camera support without signal interference; ROS2 and Jetson SDK included
Role in This Application:
3D volume and dimension verification of packaged goods on the inspection conveyor. The ToF module measures each box's height, width, and length in real time, confirming dimensions match order specifications before the item proceeds to palletizing. Also used for detecting tipped, misaligned, or damaged packages.
Form Factor / Interface:
Camera module (IP67)
Key Differentiator:
Point cloud + depth + IR outputs simultaneously; IP67 rated for washdown environments; 120fps high-speed mode; multi-camera support without signal interference; ROS2 and Jetson SDK included
Role in This Application:
Ambarella CV75-based System-on-Module providing integrated AI vision processing and camera ISP for AGV perception systems. iENSO provides the EVK platform, hardware design, and cloud services (EVPaaS), accelerating custom camera and vision module development from concept to production-ready hardware for AGV navigation and obstacle-detection pipelines.
Form Factor / Interface:
SoM (System-on-Module); Mako / Hammerhead EVK; custom camera module
Key Differentiator:
Macnica-funded partner; Ambarella CVflow AI vision architecture; full HW + SW + cloud (EVPaaS) design platform; ODM manufacturing via partners in China, Taiwan, Vietnam; NA and EU coverage; fastest path to custom AGV vision module from evaluation to production
Role in This Application:
Ambarella CV75-based System-on-Module providing integrated AI vision processing and camera ISP for AGV perception systems. iENSO provides the EVK platform, hardware design, and cloud services (EVPaaS), accelerating custom camera and vision module development from concept to production-ready hardware for AGV navigation and obstacle-detection pipelines.
Form Factor / Interface:
SoM (System-on-Module); Mako / Hammerhead EVK; custom camera module
Key Differentiator:
Macnica-funded partner; Ambarella CVflow AI vision architecture; full HW + SW + cloud (EVPaaS) design platform; ODM manufacturing via partners in China, Taiwan, Vietnam; NA and EU coverage; fastest path to custom AGV vision module from evaluation to production
Role in This Application:
Box/pallet detection and pose estimation: the robot arm uses depth data to locate incoming boxes, determine stack height, and calculate pick-and-place coordinates in 3D space.
Form Factor / Interface:
Camera module (IP67)
Key Differentiator:
Pallet detection optimized; point cloud output; dustproof IP67; multi-camera interference prevention for multi-arm cells
Role in This Application:
Camera trigger synchronization, image pre-processing (debayer, resize, ROI crop), and high-speed data routing from multiple cameras to the AI inference engine.
Form Factor / Interface:
FPGA chip / SoM / PCIe card
Key Differentiator:
Deterministic trigger timing; parallel image pre-processing; Macnica CoaXPress / SLVS-EC Interface IP plug-in; low latency
Role in This Application:
Camera trigger synchronization, image pre-processing (debayer, resize, ROI crop), and high-speed data routing from multiple cameras to the AI inference engine.
Form Factor / Interface:
FPGA chip / SoM / PCIe card
Key Differentiator:
Deterministic trigger timing; parallel image pre-processing; Macnica CoaXPress / SLVS-EC Interface IP plug-in; low latency
Role in This Application:
Camera trigger synchronization, image pre-processing (debayer, resize, ROI crop), and high-speed data routing from multiple cameras to the AI inference engine.
Form Factor / Interface:
FPGA chip / SoM / PCIe card
Key Differentiator:
Deterministic trigger timing; parallel image pre-processing; Macnica CoaXPress / SLVS-EC Interface IP plug-in; low latency
Role in This Application:
Edge compute host for the vision inspection and AI inference pipeline at the packing and assembly stations. The TANK XM811 receives processed image data from the camera gantry, runs defect classification and label verification models locally, and pushes pass/fail decisions and traceability records to the MES in real time — without relying on cloud round-trips for time-critical line decisions.
Form Factor / Interface:
Fanless industrial box PC; DIN-rail or panel-mount; standard I/O including GbE, USB, and serial for connecting to conveyor PLC, camera systems, and plant network infrastructure.
Key Differentiator:
IEI industrial-grade platform rated for factory floor operating conditions — wide temperature range, vibration tolerance, and fanless thermal design for particulate environments; pre-integrated with AIoT edge software stack; available through Macnica Americas as a validated compute platform for vision AI deployments.
Role in This Application:
Edge compute host for the vision inspection and AI inference pipeline at the packing and assembly stations. The TANK XM811 receives processed image data from the camera gantry, runs defect classification and label verification models locally, and pushes pass/fail decisions and traceability records to the MES in real time — without relying on cloud round-trips for time-critical line decisions.
Form Factor / Interface:
Fanless industrial box PC; DIN-rail or panel-mount; standard I/O including GbE, USB, and serial for connecting to conveyor PLC, camera systems, and plant network infrastructure.
Key Differentiator:
IEI industrial-grade platform rated for factory floor operating conditions — wide temperature range, vibration tolerance, and fanless thermal design for particulate environments; pre-integrated with AIoT edge software stack; available through Macnica Americas as a validated compute platform for vision AI deployments.
Role in This Application:
Edge compute host for the vision inspection and AI inference pipeline at the packing and assembly stations. The TANK XM811 receives processed image data from the camera gantry, runs defect classification and label verification models locally, and pushes pass/fail decisions and traceability records to the MES in real time — without relying on cloud round-trips for time-critical line decisions.
Form Factor / Interface:
Fanless industrial box PC; DIN-rail or panel-mount; standard I/O including GbE, USB, and serial for connecting to conveyor PLC, camera systems, and plant network infrastructure.
Key Differentiator:
IEI industrial-grade platform rated for factory floor operating conditions — wide temperature range, vibration tolerance, and fanless thermal design for particulate environments; pre-integrated with AIoT edge software stack; available through Macnica Americas as a validated compute platform for vision AI deployments.
Role in This Application:
Embedded on AMR chassis and drive joints to detect collision forces, load changes, and structural stress in real time — a safety and diagnostic layer invisible to optical sensors.
Form Factor / Interface:
Flex module (< 66mm); 2.5–3.2mm² die
Key Differentiator:
Macnica-proprietary; 0.1µε resolution; 3mW ultra-low power; enables structural health monitoring across AMR chassis, drive joints, and conveyor frames, detecting what optical sensors cannot.
Role in This Application:
Force feedback on the palletizing robot arm: detects grip force on boxes (prevents crush damage), monitors joint loads for predictive maintenance, and triggers safety stops on unexpected resistance.
Form Factor / Interface:
Flex module bonded to joint/gripper
Key Differentiator:
Macnica-proprietary; 0.1µε resolution; 3mW ultra-low power; enables structural health monitoring across AMR chassis, drive joints, and conveyor frames, detecting what optical sensors cannot.
Role in This Application:
High-performance vision processor for multi-camera box inspection and stacking verification. CVflow architecture handles multiple concurrent vision streams.
Form Factor / Interface:
SoC / camera module
Key Differentiator:
Multi-camera concurrent processing; CVflow edge AI; available via iENSO camera module platform in NA and EU
Role in This Application:
High-resolution surface inspection for fine print, micro-embossing, or large-format label mapping on a single exposure.
Form Factor / Interface:
Packaged sensor (large format)
Key Differentiator:
250MP and 410MP options for resolution-critical applications where resolution is the limiting factor; large optical format covers wide inspection fields in a single exposure; no stitching required; broad application flexibility across industrial, food, pharmaceutical, and electronics inspection
Role in This Application:
High-resolution surface inspection for fine print, micro-embossing, or large-format label mapping on a single exposure.
Form Factor / Interface:
Packaged sensor (large format)
Key Differentiator:
250MP and 410MP options for resolution-critical applications where resolution is the limiting factor; large optical format covers wide inspection fields in a single exposure; no stitching required; broad application flexibility across industrial, food, pharmaceutical, and electronics inspection
Role in This Application:
High-resolution surface inspection for fine print, micro-embossing, or large-format label mapping on a single exposure.
Form Factor / Interface:
Packaged sensor (large format)
Key Differentiator:
250MP and 410MP options for resolution-critical applications where resolution is the limiting factor; large optical format covers wide inspection fields in a single exposure; no stitching required; broad application flexibility across industrial, food, pharmaceutical, and electronics inspection
Role in This Application:
High-speed local storage for inspection image capture, AI inference logging, and traceability data at the assembly and packing stations. In a multi-camera AOI environment generating thousands of board images per shift, the MTE720T buffers raw and processed image data at PCIe Gen4 speeds before forwarding pass/fail records and defect images to the MES — ensuring no inspection data is lost even during network latency events or upstream system delays.
Form Factor / Interface:
M.2 2280 (80mm); PCIe Gen4 x4; NVMe 1.4; compatible with standard M.2 slots on edge compute platforms including the IEI TANK XM811 and CTI Jetson carrier boards. Available in 512GB, 1TB, 2TB, and 4TB capacities.
Key Differentiator:
Industrial-grade design validated for factory floor deployment — extended operating temperature -20°C to 75°C (MTE720T-I variant: -40°C to 85°C); 3,000 P/E cycle endurance rating; Corner Bond technology and anti-sulfur resistors for vibration and contamination resistance; built-in LDPC ECC and Power Shield for data integrity under unexpected power loss; sequential read/write up to 7,200/6,500 MB/s. 100% chamber-tested in-house by Transcend. Available through Macnica Americas.
Role in This Application:
High-speed local storage for inspection image capture, AI inference logging, and traceability data at the assembly and packing stations. In a multi-camera AOI environment generating thousands of board images per shift, the MTE720T buffers raw and processed image data at PCIe Gen4 speeds before forwarding pass/fail records and defect images to the MES — ensuring no inspection data is lost even during network latency events or upstream system delays.
Form Factor / Interface:
M.2 2280 (80mm); PCIe Gen4 x4; NVMe 1.4; compatible with standard M.2 slots on edge compute platforms including the IEI TANK XM811 and CTI Jetson carrier boards. Available in 512GB, 1TB, 2TB, and 4TB capacities.
Key Differentiator:
Industrial-grade design validated for factory floor deployment — extended operating temperature -20°C to 75°C (MTE720T-I variant: -40°C to 85°C); 3,000 P/E cycle endurance rating; Corner Bond technology and anti-sulfur resistors for vibration and contamination resistance; built-in LDPC ECC and Power Shield for data integrity under unexpected power loss; sequential read/write up to 7,200/6,500 MB/s. 100% chamber-tested in-house by Transcend. Available through Macnica Americas.
Role in This Application:
Industrial-grade display panels and HMI screens for operator stations at the palletizing cell and adjacent dock-door areas. Macnica's display portfolio spans standard LCD modules, high-brightness sunlight-readable panels, touch-enabled HMI screens, and custom LCD solutions — sourced and supported through a multi-brand portfolio managed directly by Macnica Americas. Panel selection is matched to the application: indoor operator HMI, high-ambient-light dock stations, or large-format floor overview displays.
Form Factor / Interface:
1.33" to 85" LCD panels; PCAP touch standard; open-frame, closed-frame, and panel-mount options; industrial and extended-temp grades available
Key Differentiator:
Multi-brand portfolio managed by Macnica Americas — single point of contact for display selection, qualification, and supply; low MOQ; long product lifecycle support; touch, optical bonding, cover glass, and custom fabrication services available
Role in This Application:
Industrial-grade display panels and HMI screens for operator stations at the palletizing cell and adjacent dock-door areas. Macnica's display portfolio spans standard LCD modules, high-brightness sunlight-readable panels, touch-enabled HMI screens, and custom LCD solutions — sourced and supported through a multi-brand portfolio managed directly by Macnica Americas. Panel selection is matched to the application: indoor operator HMI, high-ambient-light dock stations, or large-format floor overview displays.
Form Factor / Interface:
1.33" to 85" LCD panels; PCAP touch standard; open-frame, closed-frame, and panel-mount options; industrial and extended-temp grades available
Key Differentiator:
Multi-brand portfolio managed by Macnica Americas — single point of contact for display selection, qualification, and supply; low MOQ; long product lifecycle support; touch, optical bonding, cover glass, and custom fabrication services available
Role in This Application:
Integrated vision ISP + AI inference for packaging surface inspection. CVflow processes multiple camera streams simultaneously with dedicated vision pipelines.
Form Factor / Interface:
SoC / camera module (via iENSO)
Key Differentiator:
CVflow multi-stream AI; iENSO provides turnkey camera module + cloud services in NA/EU; rapid design-in
Role in This Application:
Integrated vision ISP + AI inference for packaging surface inspection. CVflow processes multiple camera streams simultaneously with dedicated vision pipelines.
Form Factor / Interface:
SoC / camera module (via iENSO)
Key Differentiator:
CVflow multi-stream AI; iENSO provides turnkey camera module + cloud services in NA/EU; rapid design-in
Role in This Application:
Low-level motor controller and safety watchdog on the AGV. Manages drive motor PWM, braking, and E-stop logic with ASIL-D functional safety integrity. PSoC handles connectivity and system supervisory functions; XMC manages real-time motor current control and position feedback from encoders.
Form Factor / Interface:
MCU + power modules
Key Differentiator:
ASIL-D certified; motor control + safety in one family; functional safety SW support
Role in This Application:
Main compute platform for full autonomy stack: sensor fusion, SLAM, path planning, and AI model execution. CTI carrier boards ruggedize the NVIDIA Jetson for warehouse environments.
Form Factor / Interface:
Embedded SBC / carrier board
Key Differentiator:
NVIDIA Elite Partner; rugged form factors; vibration/thermal rated; pre-validated for ROS2 robotics stacks
Role in This Application:
Motor driver and safety controller for the palletizing robot's servo axes. Handles current control, braking, and E-stop with hardware-level safety response.
Form Factor / Interface:
MCU + power ICs
Key Differentiator:
ASIL-D capable; full motor control ecosystem (gate drivers, current sensors, MCU in one family)
Role in This Application:
On-board edge AI inference for real-time obstacle classification, path planning decisions, and pallet detection. The DX-M1 delivers 200 TOPS of GPU-class inference at just 2–5W — purpose-built for battery-powered mobile robots that cannot support a high-power GPU compute platform.
Form Factor / Interface:
M.2 module / PCIe card / SoC
Key Differentiator:
2–5W; 200 TOPS GPU-class performance; server-grade inference at the edge; ideal for battery-powered mobile robots
Role in This Application:
On-system AI inference for box pose estimation, stacking pattern optimization, and real-time grip quality assessment in a fixed robotic palletizing cell. The DX-H1 V-NPU delivers high-throughput NPU performance designed specifically for stationary, mains-powered industrial robot environments — running vision AI models continuously without the power or thermal constraints of mobile deployments.
Form Factor / Interface:
PCIe card; installs directly into the host compute platform in the palletizing controller rack; compatible with standard industrial edge servers and embedded PCs.
Key Differentiator:
Higher performance ceiling than the DX-M1 M.2 module; purpose-built for always-on vision inference in fixed industrial robot cells; supports multi-model concurrent inference across camera streams monitoring the pick zone from multiple angles; available through Macnica Americas.
Role in This Application:
Operator HMI displays at the inspection station and control workstation showing live pass/fail rates, defect thumbnails, throughput metrics, alert notifications, and line status. Macnica's display portfolio spans standard LCD modules, high-brightness panels, touch-enabled HMI screens, and large-format overview displays — sourced and supported through a multi-brand portfolio managed directly by Macnica Americas.
Form Factor / Interface:
1.33" to 85" LCD panels; PCAP touch standard; open-frame, closed-frame, and panel-mount options; industrial and extended-temp grades available
Key Differentiator:
Multi-brand portfolio managed by Macnica Americas — single point of contact for display selection, qualification, and supply; low MOQ; long product lifecycle support; touch, optical bonding, cover glass, and custom fabrication services available
Role in This Application:
Operator HMI displays at the inspection station and control workstation showing live pass/fail rates, defect thumbnails, throughput metrics, alert notifications, and line status. Macnica's display portfolio spans standard LCD modules, high-brightness panels, touch-enabled HMI screens, and large-format overview displays — sourced and supported through a multi-brand portfolio managed directly by Macnica Americas.
Form Factor / Interface:
1.33" to 85" LCD panels; PCAP touch standard; open-frame, closed-frame, and panel-mount options; industrial and extended-temp grades available
Key Differentiator:
Multi-brand portfolio managed by Macnica Americas — single point of contact for display selection, qualification, and supply; low MOQ; long product lifecycle support; touch, optical bonding, cover glass, and custom fabrication services available
Role in This Application:
Operator HMI displays at the inspection station and control workstation showing live pass/fail rates, defect thumbnails, throughput metrics, alert notifications, and line status. Macnica's display portfolio spans standard LCD modules, high-brightness panels, touch-enabled HMI screens, and large-format overview displays — sourced and supported through a multi-brand portfolio managed directly by Macnica Americas.
Form Factor / Interface:
1.33" to 85" LCD panels; PCAP touch standard; open-frame, closed-frame, and panel-mount options; industrial and extended-temp grades available
Key Differentiator:
Multi-brand portfolio managed by Macnica Americas — single point of contact for display selection, qualification, and supply; low MOQ; long product lifecycle support; touch, optical bonding, cover glass, and custom fabrication services available
Role in This Application:
Primary navigation sensor: obstacle detection, pallet detection, SLAM mapping, gap detection, and docking alignment. Provides 3D depth data in real time as the AGV moves through the warehouse.
Form Factor / Interface:
Camera module (IP67)
Key Differentiator:
120fps high-speed mode; HDR; multi-camera support without interference; IP67 dustproof/waterproof; ROS2/Jetson SDK
Role in This Application:
Primary surface inspection sensor: captures sharp, blur-free images of packaging surfaces, labels, barcodes, and print quality at conveyor speed. Global shutter reduces motion blur and rolling shutter distortion on moving targets. Macnica holds the broadest Sony Pregius S sensor portfolio in North America.
Form Factor / Interface:
Packaged sensor (area scan; Sony IMX925 / IMX900 / IMX927 class)
Key Differentiator:
Global shutter; reduced motion blur at conveyor speed; highest resolution lineup in the Macnica portfolio; Macnica is exclusive stocking partner for Sony sensors in the Americas; Pregius S BSI architecture delivers improved sensitivity and SNR vs. original Pregius
Role in This Application:
Primary surface inspection sensor: captures sharp, blur-free images of packaging surfaces, labels, barcodes, and print quality at conveyor speed. Global shutter reduces motion blur and rolling shutter distortion on moving targets. Macnica holds the broadest Sony Pregius S sensor portfolio in North America.
Form Factor / Interface:
Packaged sensor (area scan; Sony IMX925 / IMX900 / IMX927 class)
Key Differentiator:
Global shutter; reduced motion blur at conveyor speed; highest resolution lineup in the Macnica portfolio; Macnica is exclusive stocking partner for Sony sensors in the Americas; Pregius S BSI architecture delivers improved sensitivity and SNR vs. original Pregius
Role in This Application:
Primary surface inspection sensor: captures sharp, blur-free images of packaging surfaces, labels, barcodes, and print quality at conveyor speed. Global shutter reduces motion blur and rolling shutter distortion on moving targets. Macnica holds the broadest Sony Pregius S sensor portfolio in North America.
Form Factor / Interface:
Packaged sensor (area scan; Sony IMX925 / IMX900 / IMX927 class)
Key Differentiator:
Global shutter; reduced motion blur at conveyor speed; highest resolution lineup in the Macnica portfolio; Macnica is exclusive stocking partner for Sony sensors in the Americas; Pregius S BSI architecture delivers improved sensitivity and SNR vs. original Pregius
Role in This Application:
Real-time AI defect detection inference: runs trained models to classify surface defects, label misalignments, barcode failures, and fill-level anomalies at line speed.
Form Factor / Interface:
M.2 module / PCIe card
Key Differentiator:
DX-M1: 2–5W, 200 TOPS; DX-H1: PCIe card for multi-camera analytics; both optimized for always-on factory inference
Role in This Application:
Real-time AI defect detection inference: runs trained models to classify surface defects, label misalignments, barcode failures, and fill-level anomalies at line speed.
Form Factor / Interface:
M.2 module / PCIe card
Key Differentiator:
DX-M1: 2–5W, 200 TOPS; DX-H1: PCIe card for multi-camera analytics; both optimized for always-on factory inference
Role in This Application:
Real-time AI defect detection inference: runs trained models to classify surface defects, label misalignments, barcode failures, and fill-level anomalies at line speed.
Form Factor / Interface:
M.2 module / PCIe card
Key Differentiator:
DX-M1: 2–5W, 200 TOPS; DX-H1: PCIe card for multi-camera analytics; both optimized for always-on factory inference
Role in This Application:
Real-time robot motion control interface and sensor data bus: synchronizes camera triggers, depth frame timing, and robot arm command signals with deterministic timing.
Form Factor / Interface:
FPGA chip / PCIe card
Key Differentiator:
Deterministic real-time control; Macnica CoaXPress and SLVS-EC camera interface IP; parallel processing
Role in This Application:
Real-time sensor data aggregation and pre-processing: fusing ToF depth frames, radar returns, and encoder data before handoff to the AI compute. Deterministic low-latency control loop.
Form Factor / Interface:
FPGA chip / SoM
Key Differentiator:
Parallel processing; sub-millisecond latency; reconfigurable for multi-sensor fusion; AI-optimized DSP tensor blocks
Role in This Application:
Short-range safety sensing: person/obstacle detection in the robot's immediate path. Radar operates in dust, smoke, and poor visibility where cameras degrade.
Form Factor / Interface:
REAL3: chip-level sensor module; BGT60TR13C: SMD radar IC / antenna module
Key Differentiator:
REAL3: sunlight-robust single-chip ToF imager; smallest ToF camera module designs; scalable to industrial/consumer/automotive. BGT60TR13C: 60GHz FMCW radar; works through packaging debris; no camera occlusion risk; ASIL-D MCU support via Infineon PSoC family
Role in This Application:
Structural load monitoring on the inspection conveyor frame and pneumatic pressing/labeling stations. Detects abnormal forces that indicate jams, misfeeds, or mechanical wear before failure.
Form Factor / Interface:
Flex module bonded to frame/fixture
Key Differentiator:
Macnica-proprietary; 0.1µε resolution; 3mW ultra-low power; enables structural health monitoring across AMR chassis, drive joints, and conveyor frames, detecting what optical sensors cannot.
Role in This Application:
Structural load monitoring on the inspection conveyor frame and pneumatic pressing/labeling stations. Detects abnormal forces that indicate jams, misfeeds, or mechanical wear before failure.
Form Factor / Interface:
Flex module bonded to frame/fixture
Key Differentiator:
Macnica-proprietary; 0.1µε resolution; 3mW ultra-low power; enables structural health monitoring across AMR chassis, drive joints, and conveyor frames, detecting what optical sensors cannot.
Role in This Application:
Structural load monitoring on the inspection conveyor frame and pneumatic pressing/labeling stations. Detects abnormal forces that indicate jams, misfeeds, or mechanical wear before failure.
Form Factor / Interface:
Flex module bonded to frame/fixture
Key Differentiator:
Macnica-proprietary; 0.1µε resolution; 3mW ultra-low power; enables structural health monitoring across AMR chassis, drive joints, and conveyor frames, detecting what optical sensors cannot.
Role in This Application:
System-level controller: manages conveyor belt I/O, pneumatic reject actuators (diverters), indicator lights, and safe E-stop. Integrates with PLC via industrial protocols.
Form Factor / Interface:
MCU + power modules
Key Differentiator:
ASIL-D safety; full motor/actuator control; connectivity (Wi-Fi, BT, USB) in one MCU family
Role in This Application:
System-level controller: manages conveyor belt I/O, pneumatic reject actuators (diverters), indicator lights, and safe E-stop. Integrates with PLC via industrial protocols.
Form Factor / Interface:
MCU + power modules
Key Differentiator:
ASIL-D safety; full motor/actuator control; connectivity (Wi-Fi, BT, USB) in one MCU family
Role in This Application:
System-level controller: manages conveyor belt I/O, pneumatic reject actuators (diverters), indicator lights, and safe E-stop. Integrates with PLC via industrial protocols.
Form Factor / Interface:
MCU + power modules
Key Differentiator:
ASIL-D safety; full motor/actuator control; connectivity (Wi-Fi, BT, USB) in one MCU family
Role in This Application:
Two Macnica-developed FPGA IP cores that handle high-speed camera data transport from inspection cameras to the processing pipeline. The SLVS-EC v3.1 RX IP interfaces directly with the latest Sony Pregius S image sensors — the same sensors used in the Capture layer of this station. The CoaXPress 1.1 Device Package enables coaxial cable image transmission for longer-distance camera-to-FPGA connections, and includes a GenICam software library to accelerate application development. Both IP cores run on Altera FPGAs and eliminate the need for discrete frame grabber hardware.
Form Factor / Interface:
FPGA IP core (two separate products); both integrate into Altera Agilex and Cyclone 10 FPGA designs via standard HDL instantiation; the CoaXPress package includes a companion GenICam software library.
Key Differentiator:
Macnica-exclusive IP developed in-house — not available from any other source; SLVS-EC v3.1 RX is natively optimized for Sony Pregius S sensors, the same high-speed global shutter sensors in the Capture layer, ensuring a seamless sensor-to-FPGA data path; CoaXPress 1.1 supports multi-camera configurations over standard coaxial cable with GenICam compatibility, reducing development time for camera integration; together they eliminate the frame grabber hardware layer, simplifying system architecture and reducing BOM cost.
Role in This Application:
Two Macnica-developed FPGA IP cores that handle high-speed camera data transport from inspection cameras to the processing pipeline. The SLVS-EC v3.1 RX IP interfaces directly with the latest Sony Pregius S image sensors — the same sensors used in the Capture layer of this station. The CoaXPress 1.1 Device Package enables coaxial cable image transmission for longer-distance camera-to-FPGA connections, and includes a GenICam software library to accelerate application development. Both IP cores run on Altera FPGAs and eliminate the need for discrete frame grabber hardware.
Form Factor / Interface:
FPGA IP core (two separate products); both integrate into Altera Agilex and Cyclone 10 FPGA designs via standard HDL instantiation; the CoaXPress package includes a companion GenICam software library.
Key Differentiator:
Macnica-exclusive IP developed in-house — not available from any other source; SLVS-EC v3.1 RX is natively optimized for Sony Pregius S sensors, the same high-speed global shutter sensors in the Capture layer, ensuring a seamless sensor-to-FPGA data path; CoaXPress 1.1 supports multi-camera configurations over standard coaxial cable with GenICam compatibility, reducing development time for camera integration; together they eliminate the frame grabber hardware layer, simplifying system architecture and reducing BOM cost.
Role in This Application:
Two Macnica-developed FPGA IP cores that handle high-speed camera data transport from inspection cameras to the processing pipeline. The SLVS-EC v3.1 RX IP interfaces directly with the latest Sony Pregius S image sensors — the same sensors used in the Capture layer of this station. The CoaXPress 1.1 Device Package enables coaxial cable image transmission for longer-distance camera-to-FPGA connections, and includes a GenICam software library to accelerate application development. Both IP cores run on Altera FPGAs and eliminate the need for discrete frame grabber hardware.
Form Factor / Interface:
FPGA IP core (two separate products); both integrate into Altera Agilex and Cyclone 10 FPGA designs via standard HDL instantiation; the CoaXPress package includes a companion GenICam software library.
Key Differentiator:
Macnica-exclusive IP developed in-house — not available from any other source; SLVS-EC v3.1 RX is natively optimized for Sony Pregius S sensors, the same high-speed global shutter sensors in the Capture layer, ensuring a seamless sensor-to-FPGA data path; CoaXPress 1.1 supports multi-camera configurations over standard coaxial cable with GenICam compatibility, reducing development time for camera integration; together they eliminate the frame grabber hardware layer, simplifying system architecture and reducing BOM cost.
Role in This Application:
Two Macnica-developed FPGA IP cores that handle high-speed camera data transport from inspection cameras to the processing pipeline. The SLVS-EC v3.1 RX IP interfaces directly with the latest Sony Pregius S image sensors — the same sensors used in the Capture layer of this station. The CoaXPress 1.1 Device Package enables coaxial cable image transmission for longer-distance camera-to-FPGA connections, and includes a GenICam software library to accelerate application development. Both IP cores run on Altera FPGAs and eliminate the need for discrete frame grabber hardware.
Form Factor / Interface:
FPGA IP core (two separate products); both integrate into Altera Agilex and Cyclone 10 FPGA designs via standard HDL instantiation; the CoaXPress package includes a companion GenICam software library.
Key Differentiator:
Macnica-exclusive IP developed in-house — not available from any other source; SLVS-EC v3.1 RX is natively optimized for Sony Pregius S sensors, the same high-speed global shutter sensors in the Capture layer, ensuring a seamless sensor-to-FPGA data path; CoaXPress 1.1 supports multi-camera configurations over standard coaxial cable with GenICam compatibility, reducing development time for camera integration; together they eliminate the frame grabber hardware layer, simplifying system architecture and reducing BOM cost.
Role in This Application:
Wireless connectivity between AGVs and the warehouse management system (WMS). Maintains fleet coordination, task assignment, and real-time telemetry over the factory Wi-Fi network.
Form Factor / Interface:
Wireless module / SoM
Key Differentiator:
Wi-Fi 7 ready; Qualcomm QCS6490 platform; always-on connectivity; pre-validated RF subsystem
Role in This Application:
Wireless link from the palletizing cell controller to the WMS/ERP: reports completed pallet IDs, weight data, and throughput in real time.
Form Factor / Interface:
Wireless module
Key Differentiator:
Wi-Fi 6/7; pre-validated RF; low integration effort for industrial OEM embedding
Role in This Application:
Wireless uplink from inspection stations to MES/ERP: streams defect event data, images, and quality metrics in real time for traceability and SPC.
Form Factor / Interface:
Wireless module / SoM
Key Differentiator:
Wi-Fi 7 capable; always-on connectivity; low integration effort; QCS6490 Qualcomm platform
Role in This Application:
Wireless uplink from inspection stations to MES/ERP: streams defect event data, images, and quality metrics in real time for traceability and SPC.
Form Factor / Interface:
Wireless module / SoM
Key Differentiator:
Wi-Fi 7 capable; always-on connectivity; low integration effort; QCS6490 Qualcomm platform
Role in This Application:
Wireless uplink from inspection stations to MES/ERP: streams defect event data, images, and quality metrics in real time for traceability and SPC.
Form Factor / Interface:
Wireless module / SoM
Key Differentiator:
Wi-Fi 7 capable; always-on connectivity; low integration effort; QCS6490 Qualcomm platform
Role in This Application:
Embedded compute platform running the full inspection SW stack: image acquisition, AI inference, pass/fail logic, and data logging.
Form Factor / Interface:
SBC / embedded module
Key Differentiator:
NVIDIA Jetson ecosystem; CTI ruggedized carriers for factory floor; industrial temp and vibration rated
Role in This Application:
Embedded compute platform running the full inspection SW stack: image acquisition, AI inference, pass/fail logic, and data logging.
Form Factor / Interface:
SBC / embedded module
Key Differentiator:
NVIDIA Jetson ecosystem; CTI ruggedized carriers for factory floor; industrial temp and vibration rated
Role in This Application:
Rugged embedded compute for the palletizing cell controller: runs the robot motion planning stack, AI inference, and safety monitor simultaneously.
Form Factor / Interface:
SBC / carrier board
Key Differentiator:
Industrial-grade vibration/thermal rating; NVIDIA Jetson ecosystem; CTI rugged carrier board options
Role in This Application:
Worker safety detection in the robot's reach envelope. Radar detects human presence even in dusty warehouse conditions where camera-based safety curtains may be unreliable.
Form Factor / Interface:
Sensor module
Key Differentiator:
Operates through dust/packaging debris; no camera occlusion risk; safety zone monitoring
Role in This Application:
Optional ultra-high-resolution pass for label quality inspection and fine print verification on packaging — used where Sony resolution is insufficient.
Form Factor / Interface:
Bare sensor die
Key Differentiator:
Ultra-high resolution for fine print, micro-embossing, and regulatory label verification; complementary for resolution-limited applications; broad application flexibility across industrial, medical, and commercial use cases. Acceptable for Defense Applications
Role in This Application:
Wireless data backhaul for the STREAL strain sensor network deployed across the factory floor. SmartMesh IP creates a self-forming, self-healing wireless mesh between STREAL nodes on conveyor frames, robot joints, and press fixtures, routing structural health data to the edge server running the digital twin and predictive maintenance software — without requiring wired sensor runs across a live production environment.
Form Factor / Interface:
Pre-certified PCB module (mote) and companion network manager; 2.4GHz IEEE 802.15.4e; 6LoWPAN-compliant; available as chip (LTC5800-IPM) or PCBA module with integrated antenna (LTP5901-IPM). Starter Kit (DC9018B) available through Macnica Americas for rapid network prototyping.
Key Differentiator:
Greater than 99.999% data reliability in the most challenging RF environments using Time Synchronized Channel Hopping — proven in industrial plants with extensive metal and concrete where standard Wi-Fi and Bluetooth mesh fail; sub-50µA routing node power consumption enabling greater than 10-year battery life, making wireless sensor placement practical anywhere on the factory floor without infrastructure runs; self-forming mesh requires no wireless stack development — nodes join and route automatically; AES-128 encryption and message integrity built in; validated in production at Analog Devices' own wafer fab facility across 83 days and 26 million data packets with zero network failures.
Role in This Application:
Wireless data backhaul for the STREAL strain sensor network deployed across the factory floor. SmartMesh IP creates a self-forming, self-healing wireless mesh between STREAL nodes on conveyor frames, robot joints, and press fixtures, routing structural health data to the edge server running the digital twin and predictive maintenance software — without requiring wired sensor runs across a live production environment.
Form Factor / Interface:
Pre-certified PCB module (mote) and companion network manager; 2.4GHz IEEE 802.15.4e; 6LoWPAN-compliant; available as chip (LTC5800-IPM) or PCBA module with integrated antenna (LTP5901-IPM). Starter Kit (DC9018B) available through Macnica Americas for rapid network prototyping.
Key Differentiator:
Greater than 99.999% data reliability in the most challenging RF environments using Time Synchronized Channel Hopping — proven in industrial plants with extensive metal and concrete where standard Wi-Fi and Bluetooth mesh fail; sub-50µA routing node power consumption enabling greater than 10-year battery life, making wireless sensor placement practical anywhere on the factory floor without infrastructure runs; self-forming mesh requires no wireless stack development — nodes join and route automatically; AES-128 encryption and message integrity built in; validated in production at Analog Devices' own wafer fab facility across 83 days and 26 million data packets with zero network failures.